Mixing and defoaming equipment - Company Ranking(6 companies in total)
Last Updated: Aggregation Period:Sep 17, 2025〜Oct 14, 2025
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Display Company Information
Company Name | Featured Products | ||
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Product Image, Product Name, Price Range | overview | Application/Performance example | |
■Maximum load capacity / 310g *Total mass including materials, containers, adapters, etc. ■Standard container / Volume 300 mL and 150 mL... | Stirring of low to high viscosity materials and defoaming at the submicron level. | ||
■Maximum load capacity / 140g *Total weight including materials, containers, adapters, etc. ■Standard container / 100ml disposable conta... | Stirring, dispersing, degassing, and deairing of materials. | ||
■Maximum load capacity / 700g *Total weight including materials, containers, adapters, etc. ■Standard container / 550mL resin container ... | ■Examples of Use Resin for Injection Molding Dam Material for Semiconductors High Viscosity Adhesive *For more details, please refe... | ||
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- Featured Products
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Stirring and Defoaming Device | Awatori Rentaro ARV-310P
- overview
- ■Maximum load capacity / 310g *Total mass including materials, containers, adapters, etc. ■Standard container / Volume 300 mL and 150 mL...
- Application/Performance example
- Stirring of low to high viscosity materials and defoaming at the submicron level.
Research and development - Small stirring and defoaming device | Awatori Rentaro AR-100
- overview
- ■Maximum load capacity / 140g *Total weight including materials, containers, adapters, etc. ■Standard container / 100ml disposable conta...
- Application/Performance example
- Stirring, dispersing, degassing, and deairing of materials.
Vacuum Type Stirring and Defoaming Device | Awatori Rentaro ARV-501
- overview
- ■Maximum load capacity / 700g *Total weight including materials, containers, adapters, etc. ■Standard container / 550mL resin container ...
- Application/Performance example
- ■Examples of Use Resin for Injection Molding Dam Material for Semiconductors High Viscosity Adhesive *For more details, please refe...
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